111 lines
3.0 KiB
C#
111 lines
3.0 KiB
C#
using System.ComponentModel;
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namespace DispenserCommon.Events;
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/// <summary>
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/// 通过事件发布订阅模式实现系统各组件的解耦
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/// 这里定义的是事件的驱动类型
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/// </summary>
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public enum EventType
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{
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// 系统初始化事件
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[Description("系统初始化事件")] SetupNotify,
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[Description("系统已经启动事件")] StartUp,
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// 锁机事件
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[Description("锁机事件")] LockEvent,
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[Description("许可无效事件")] LicenseInvalidEvent,
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[Description("异常信息")] Exception,
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[Description("解决异常信息")] SolveFault,
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[Description("操作日志")] OperationLog,
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[Description("动打状态")] StrikeState,
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[Description("生产作业过程状态信息")] ProductionState,
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[Description("动打路径范围")] StrokePath,
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[Description("传感器状态更新")] SensorState,
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// 相机数据
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[Description("测距仪数据")] CameraData,
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//参数修改
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[Description("参数修改")] ConfigChange,
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// 晶环上料确认事件
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[Description("晶环上料确认事件")] WaferLoadingConfirmed,
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// 芯片缺料事件
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[Description("芯片缺料事件")] ChipLacking,
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// 晶环上料事件
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[Description("晶环上料事件")] WaferLoading,
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// 晶环旋转事件
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[Description("晶环旋转事件")] WaferRotation,
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// 晶环旋转失败事件
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[Description("晶环旋转失败事件")] WaferRotationFailure,
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// 晶环下料事件
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[Description("晶环下料事件")] WaferUnloading,
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// 基板上料确认事件
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[Description("PCB上料确认事件")] PcbLoadingConfirmed,
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// 基板上料事件
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[Description("PCB上料事件")] PcbLoading,
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// 基板下料事件
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[Description("PCB下料事件")] PcbUnloading,
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// 针刺组件移动到指定位置事件
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[Description("针刺组件移动")] NeedleMoveTo,
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// 晶环组件移动到自定位置事件
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[Description("晶环组件移动")] WaferMoveTo,
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// pcb上料完成事件
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[Description("基板上料完成")] PcbLoadingCompleted,
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// pcb下料完成事件
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[Description("基板下料完成")] PcbUnloadingCompleted,
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// 晶圆上料完成事件
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[Description("基板上料完成")] WaferLoadingCompleted,
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// 晶圆下料完成事件
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[Description("基板下料完成")] WaferUnloadingCompleted,
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// 整机回零完成事件
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[Description("整机回零完成")] TotalResetCompleted,
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[Description("基板扫描完成")] PcbScanCompleted,
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[Description("晶圆扫描完成")] WaferScanCompleted,
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[Description("整体扫描完成")] ScanCompleted,
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[Description("步序信息")] StepInfo,
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[Description("生产配置界面切换")] SettingChanged,
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[Description("切换步骤")] StepChanged,
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[Description("切换菜单")] MenuChanged,
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[Description("菜单按钮切换事件")] PageChanged,
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[Description("MQTT 接收到数据")] MqttMessage,
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StartScan,
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[Description("错误日志")] PopLog,
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[Description("滚动日志")] RollingLog
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} |